Meiki MHPC-V-300-300-1-25 PCB Hot Lamination Press 300 x 300 mm 245 kN

Description

Meiki MHPC-V-300-1-25 Printed Circuit Board Hot Lamination Press
Comes with what you see in the pictures. If you don't see it, you probably wont get it.
Specifications are from Meiki and may vary slightly due to upgrades, options, or revisions this unit may or may not have.
The unit was removed from service in working condition and professionally deinstalled. It was Intel surplus. We do not have the expertise to test this tool. Inspection is available and recommended. I will try to get more pictures of the unit in the near future.
The Unit's Serial Number Tag Reads:
Model Number:
MHPC-V-300-300-1-25
Serial Number:
B1110-022
Total Pressure:
245 kN
Size of Platen:
300 x 300 mm
Number of Openings:
1
Daylight Openings:
150 mm
Diameter of Ram:
160 mm
Maximum Hydraulic Pressure:
12.3 MPa
Date of Manufacturer:
10.05.2002
Input Power:
208 V @ 60 Hz, 3 Phase, 3 Wire, 100 Amp Capacity, 50 Amp F.L.C.
Power Capacity:
100 A
Additional Description:
Vistac II-B Controller
Vacuum hot press for multi-layer printed circuit board molding
0.00 minimum for packaging, handling, and order processing. Shipping to be determined by destination.
Prior to shipment I will need to know the following information (filled out on a form that I will send you) for International Customers or Packages/Freight being Forwarded internationally. International customers may also be subject to a freight forwarder form if applicable.:
(1) Are you the end-user of this item?
(2) If you are not the ultimate end-user of the item, please state the ultimate end user's name.
(3) What is the ultimate country destination?
05/19/09